Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6702175 | Method of soldering using lead-free solder and bonded article prepared through soldering by the method | Kazumi Matsushige, Takashi Ikari, Kenichiro Suetsugu, Masato Hirano, Shunji Hibino +1 more | 2004-03-09 |