Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6805282 | Flow soldering process and apparatus | Yasuji Kawashima, Shunji Hibino, Hiroaki Takano, Tatsuo Okuji, Shoshi Kabashima +2 more | 2004-10-19 |
| 6702175 | Method of soldering using lead-free solder and bonded article prepared through soldering by the method | Kazumi Matsushige, Toshihisa Horiuchi, Takashi Ikari, Masato Hirano, Shunji Hibino +1 more | 2004-03-09 |