Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6746962 | Method for fabricating a semi-conductor device having a tungsten film-filled via hole | Takenobu Kishida, Takeshi Harada, Hiromitsu Abe, Mitsunari Satake, Kenichi Kunimitsu | 2004-06-08 |