Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6746962 | Method for fabricating a semi-conductor device having a tungsten film-filled via hole | Takenobu Kishida, Takeshi Harada, Toru Hinomura, Hiromitsu Abe, Kenichi Kunimitsu | 2004-06-08 |
| 6737348 | Method for forming buried interconnect | Masashi Hamanaka, Hideaki Yoshida | 2004-05-18 |