Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6720207 | Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device | Masanori Minamio, Fumihiko Kawai, Masahiko Ohiro, Yoshinori Satoh, Akira Oga +1 more | 2004-04-13 |