Issued Patents 2004
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6720207 | Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device | Fumihiko Kawai, Masahiko Ohiro, Masanori Koichi, Yoshinori Satoh, Akira Oga +1 more | 2004-04-13 |
| 6710430 | Resin-encapsulated semiconductor device and method for manufacturing the same | Toru Nomura, Fumihiko Kawai | 2004-03-23 |
| 6692991 | Resin-encapsulated semiconductor device and method for manufacturing the same | Toru Nomura | 2004-02-17 |
| 6680220 | Method of embedding an identifying mark on the resin surface of an encapsulated semiconductor package | Hiroaki Fujimoto, Ryuichi Sahara, Toshiyuki Fukuda, Toru Nomura | 2004-01-20 |
| 6680524 | Semiconductor device and method for fabricating the same | Hiroaki Fujimoto, Ryuichi Sahara, Toshiyuki Fukuda, Toru Nomura | 2004-01-20 |
| 6674154 | Lead frame with multiple rows of external terminals | Toru Nomura, Fumihiko Kawai | 2004-01-06 |