Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6764952 | Systems and methods to retard copper diffusion and improve film adhesion for a dielectric barrier on copper | Jengyi Yu, Ka Shun Wong, Sanjeev Kumar Jain, Haiying Fu, Atul Gupta +1 more | 2004-07-20 |