Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6822333 | Methods of filling constrained spaces with insulating materials and/or of forming contact holes and/or contacts in an integrated circuit | — | 2004-11-23 |
| 6764952 | Systems and methods to retard copper diffusion and improve film adhesion for a dielectric barrier on copper | Ka Shun Wong, Sanjeev Kumar Jain, Somnath Nag, Haiying Fu, Atul Gupta +1 more | 2004-07-20 |