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Chin Jeng Liu

SC Siliconware Precision Industries Co.: 1 patents #29 of 67Top 45%
Overall (2004): #246,536 of 270,089Top 95%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6809408 Semiconductor package with die pad having recessed portion Chen-Shih Yu, Chih-Jen Yang, Hung Jui-Hsiang, Chen Yang 2004-10-26