Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6809408 | Semiconductor package with die pad having recessed portion | Chen-Shih Yu, Hung Jui-Hsiang, Chin Jeng Liu, Chen Yang | 2004-10-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6809408 | Semiconductor package with die pad having recessed portion | Chen-Shih Yu, Hung Jui-Hsiang, Chin Jeng Liu, Chen Yang | 2004-10-26 |