Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6797632 | Bonded wafer producing method and bonded wafer | Kiyoshi Mitani, Shinichi Tomizawa | 2004-09-28 |
| 6720640 | Method for reclaiming delaminated wafer and reclaimed delaminated wafer | Susumu Kuwabara, Kiyoshi Mitani, Naoto Tate, Thierry Barge, Christophe Maleville | 2004-04-13 |