Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6797632 | Bonded wafer producing method and bonded wafer | Masatake Nakano, Shinichi Tomizawa | 2004-09-28 |
| 6784494 | Production method for SOI wafer and SOI wafer | — | 2004-08-31 |
| 6720640 | Method for reclaiming delaminated wafer and reclaimed delaminated wafer | Susumu Kuwabara, Naoto Tate, Masatake Nakano, Thierry Barge, Christophe Maleville | 2004-04-13 |
| 6716722 | Method of producing a bonded wafer and the bonded wafer | Jun-ichiro Furihata | 2004-04-06 |