Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6809020 | Method for forming bump, semiconductor device and method for making the same, circuit board, and electronic device | Kazunori Sakurai, Tsutomu Ota, Akira Makabe | 2004-10-26 |