Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6809020 | Method for forming bump, semiconductor device and method for making the same, circuit board, and electronic device | Kazunori Sakurai, Tsutomu Ota, Fumiaki Matsushima | 2004-10-26 |
| 6690423 | Solid-state image pickup apparatus | Nobuo Nakamura, Hisanori Ihara, Ikuko Inoue, Hidenori Shibata, Akiko Nomachi +8 more | 2004-02-10 |