Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6793767 | Wafer stage including electrostatic chuck and method for dechucking wafer using the wafer stage | Chang-Woong Chu, Ji Soo Kim, Seung-Pil Chung, Sang-Hun Seo | 2004-09-21 |
| 6767834 | Method of manufacturing a contact of a semiconductor device using cluster apparatus having at least one plasma pretreatment module | Seung-Pil Chung, Ji Soo Kim, Chang-Woong Chu, Sang-Hun Seo | 2004-07-27 |