Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6709970 | Method for creating a damascene interconnect using a two-step electroplating process | Chankeun Park, Sangrok Hah, Hongseong Son, Byunglyul Park | 2004-03-23 |
JC
Juhyuck Chung
Overall (2004): #185,172 of 270,089Top 70%
1
Patents 2004