Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6709970 | Method for creating a damascene interconnect using a two-step electroplating process | Sangrok Hah, Juhyuck Chung, Hongseong Son, Byunglyul Park | 2004-03-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6709970 | Method for creating a damascene interconnect using a two-step electroplating process | Sangrok Hah, Juhyuck Chung, Hongseong Son, Byunglyul Park | 2004-03-23 |