Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6833607 | Resin-molded semiconductor device that includes at least one additional electronic part | Makoto Terui | 2004-12-21 |
| 6806564 | Semiconductor apparatus with decoupling capacitor | Makoto Terui | 2004-10-19 |
| 6707146 | Semiconductor apparatus with decoupling capacitor | Makoto Terui | 2004-03-16 |