Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6833607 | Resin-molded semiconductor device that includes at least one additional electronic part | Noritaka Anzai | 2004-12-21 |
| 6831354 | Semiconductor package and method of fabricating same | Takahiro Oka | 2004-12-14 |
| 6806564 | Semiconductor apparatus with decoupling capacitor | Noritaka Anzai | 2004-10-19 |
| 6707146 | Semiconductor apparatus with decoupling capacitor | Noritaka Anzai | 2004-03-16 |