Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6812558 | Wafer scale package and method of assembly | Li-Shu Chen, Philip C. Smith, Howard Fudem | 2004-11-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6812558 | Wafer scale package and method of assembly | Li-Shu Chen, Philip C. Smith, Howard Fudem | 2004-11-02 |