Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6812558 | Wafer scale package and method of assembly | Philip C. Smith, Thomas Moloney, Howard Fudem | 2004-11-02 |
| 6777765 | Capacitive type microelectromechanical RF switch | Howard Fudem, Donald E. Crockett, III, Philip C. Smith | 2004-08-17 |