Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6713682 | Through hole conduction structure of flexible multilayer circuit board and forming method thereof | Kenichi Hirahara, Kunihiko Azeyanagi | 2004-03-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6713682 | Through hole conduction structure of flexible multilayer circuit board and forming method thereof | Kenichi Hirahara, Kunihiko Azeyanagi | 2004-03-30 |