Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6713682 | Through hole conduction structure of flexible multilayer circuit board and forming method thereof | Kenichi Hirahara, Toshiyuki Tsukahara | 2004-03-30 |
| 6687984 | Method for manufacturing flexible multilayer circuit board | Akihiko Toyoshima, Katsunori Kokubun | 2004-02-10 |