Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6774748 | RF package with multi-layer substrate having coplanar feed through and connection interface | Masaharu Ito, Kazuhiro Ikuina, Keiichi Ohata | 2004-08-10 |
| 6674347 | Multi-layer substrate suppressing an unwanted transmission mode | Masaharu Ito, Keiichi Ohata | 2004-01-06 |