Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6774748 | RF package with multi-layer substrate having coplanar feed through and connection interface | Masaharu Ito, Kenichi Maruhashi, Keiichi Ohata | 2004-08-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6774748 | RF package with multi-layer substrate having coplanar feed through and connection interface | Masaharu Ito, Kenichi Maruhashi, Keiichi Ohata | 2004-08-10 |