Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6693020 | Method of preparing copper metallization die for wirebonding | Kok Mui, Fuaida Harun, Lan Chu Tan | 2004-02-17 |
MN
Mohd Faizairi Bin Mohd Nor
Overall (2004): #149,118 of 270,089Top 60%
1
Patents 2004