Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6693020 | Method of preparing copper metallization die for wirebonding | Kok Mui, Fuaida Harun, Mohd Faizairi Bin Mohd Nor | 2004-02-17 |
LT
Lan Chu Tan
Overall (2004): #169,858 of 270,089Top 65%
1
Patents 2004