Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6831129 | Resin-coated copper foil, and printed wiring board using resin-coated copper foil | Tetsuro Sato, Toshifumi Matsushima | 2004-12-14 |
| 6716530 | RESIN COMPOUND FOR FABRICATING INTERLAYER DIELECTRIC OF PRINTED WIRING BOARD, RESIN SHEET AND RESIN APPLIED-COPPER FOIL FOR FORMING INSULATION LAYER USING THE RESIN COMPOUND, AND COPPER-CLAD LAMINATE USING THEM | Tetsuro Sato | 2004-04-06 |