Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6831129 | Resin-coated copper foil, and printed wiring board using resin-coated copper foil | Tetsuro Sato, Tsutomu Asai | 2004-12-14 |
| 6693793 | Double-sided copper clad laminate for capacitor layer formation and its manufacturing method | Fujio Kuwako, Kazuhiro Yamazaki | 2004-02-17 |