Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6750422 | Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole | Morio Gaku, Yasuo Tanaka, Yoshihiro Kato | 2004-06-15 |
| 6736988 | Copper-clad board suitable for making hole with carbon dioxide laser, method of making hole in said copper-clad board and printed wiring board comprising said copper-clad board | Morio Gaku, Yoshihiro Kato, Taro Yoshida | 2004-05-18 |
| 6720651 | Semiconductor plastic package and process for the production thereof | Morio Gaku, Nobuyuki Yamane | 2004-04-13 |
| 6708404 | Method of producing high-density copper clad multi-layered printed wiring board having highly reliable through hole | Morio Gaku, Yoshihiro Kato, Hiroki Aoto | 2004-03-23 |
| 6680152 | Photosensitive resin composition | Kenji Ishii, Takabumi Omori, Daisuke Ohno | 2004-01-20 |