Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6708404 | Method of producing high-density copper clad multi-layered printed wiring board having highly reliable through hole | Morio Gaku, Nobuyuki Ikeguchi, Yoshihiro Kato | 2004-03-23 |