Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6780769 | Method of manufacturing structure for connecting interconnect lines including metal layer with thickness larger than thickness of metallic compound layer | Masahiko Fujisawa, Akihiko Ohsaki | 2004-08-24 |
| 6737319 | Method of manufacturing semiconductor device and semiconductor device | Masazumi Matsuura, Kinya Goto | 2004-05-18 |
| 6734489 | Semiconductor element and MIM-type capacitor formed in different layers of a semiconductor device | Kinya Goto, Masahiro Matsumoto | 2004-05-11 |