Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6780769 | Method of manufacturing structure for connecting interconnect lines including metal layer with thickness larger than thickness of metallic compound layer | Akihiko Ohsaki, Noboru Morimoto | 2004-08-24 |
| 6716731 | Semiconductor device and method for reducing contact resistance between an electrode and a semiconductor substrate | — | 2004-04-06 |