Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825249 | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device | Shinji Takeda, Takashi Masuko, Masami Yusa, Yasuo Miyadera, Mituo Yamasaki +7 more | 2004-11-30 |
| 6797733 | Expandable styrene resin particles, expandable beads, and foamed article | Makoto Kunimi, Tetsuya Katou, Hiroshi Nakaguki, Toshio Akima | 2004-09-28 |