Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825249 | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device | Shinji Takeda, Takashi Masuko, Yasuo Miyadera, Mituo Yamasaki, Iwao Maekawa +7 more | 2004-11-30 |
| 6762249 | Wiring-connecting material and process for producing circuit board with the same | Tohru Fujinawa, Satoyuki Nomura, Hiroshi Ono, Itsuo Watanabe, Motohiro Arifuku +1 more | 2004-07-13 |
| 6717242 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa +3 more | 2004-04-06 |