Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6787917 | Apparatus for package reduction in stacked chip and board assemblies | Kian Lee | 2004-09-07 |
| 6762503 | Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing same | — | 2004-07-13 |
| 6756251 | Method of manufacturing microelectronic devices, including methods of underfilling microelectronic components through an underfill aperture | — | 2004-06-29 |
| 6720666 | BOC BGA package for die with I-shaped bond pad layout | Thiam Chye Lim, Kay Kit Tan, Kian Lee, Victor Tan, Kwang Hong Tan +4 more | 2004-04-13 |
| 6692987 | BOC BGA package for die with I-shaped bond pad layout | Thiam Chye Lim, Kay Kit Tan, Kian Lee, Victor Tan, Kwang Hong Tan +4 more | 2004-02-17 |