Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6787917 | Apparatus for package reduction in stacked chip and board assemblies | Teck Kheng Lee | 2004-09-07 |
| 6787923 | Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks | Cher Khng Victor Tan, Choon Kuan Lee, Guek Har Lim, Wuu Yean Tay, Teck Huat Poh +1 more | 2004-09-07 |
| 6720666 | BOC BGA package for die with I-shaped bond pad layout | Thiam Chye Lim, Kay Kit Tan, Victor Tan, Kwang Hong Tan, Chong Pei Andrew Lim +4 more | 2004-04-13 |
| 6692987 | BOC BGA package for die with I-shaped bond pad layout | Thiam Chye Lim, Kay Kit Tan, Victor Tan, Kwang Hong Tan, Chong Pei Andrew Lim +4 more | 2004-02-17 |