Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825572 | Die package | Edmund Lua Koon Tian | 2004-11-30 |
| 6773960 | Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate | Setho Sing Fee, Tay Wuu Yean | 2004-08-10 |
| 6746894 | Ball grid array interposer, packages and methods | Setho Sing Fee, Steven W. Heppler, Leng Nam Yin, Keith Tan, Patrick Guay +3 more | 2004-06-08 |