Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825572 | Die package | Lim Thiam Chye | 2004-11-30 |
| 6746894 | Ball grid array interposer, packages and methods | Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan +3 more | 2004-06-08 |