Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6802945 | Method of metal sputtering for integrated circuit metal routing | Hsien-Tsung Liu, Ching-San Lin | 2004-10-12 |
| 6784087 | Method of fabricating cylindrical bonding structure | Jin-Yuan Lee, Shih-Hsiung Lin, Hsi-Shan Kuo | 2004-08-31 |
| 6716740 | Method for depositing silicon oxide incorporating an outgassing step | Shih-Ming Wang, Long-Shang Chuang, Jui-Ping Chuang, Chin-Hsiung Ho, Mei-Yen Li | 2004-04-06 |