Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6791192 | Multiple chips bonded to packaging structure with low noise and multiple selectable functions | Mou-Shiung Lin | 2004-09-14 |
| 6768208 | Multiple chips bonded to packaging structure with low noise and multiple selectable functions | Mou-Shiung Lin | 2004-07-27 |