Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6836022 | High voltage flip-chip component package and method for forming the same | Mark R. Boone, Andreas Fenner, Lary R. Larson | 2004-12-28 |
| 6696318 | Methods for forming a die package | — | 2004-02-24 |