Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6836022 | High voltage flip-chip component package and method for forming the same | Mark R. Boone, Juan G. Milla, Lary R. Larson | 2004-12-28 |
| 6806494 | Method and apparatus for wafer-level burn-in and testing of integrated circuits | David L. Thompson | 2004-10-19 |
| 6707065 | Method and apparatus for wafer-level burn-in and testing of integrated circuits | David L. Thompson | 2004-03-16 |