Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6818996 | Multi-level redistribution layer traces for reducing current crowding in flipchip solder bumps | Atila Mertol | 2004-11-16 |
| 6700207 | Flip-chip ball grid array package for electromigration testing | Anand Govind, Carl Iwashita | 2004-03-02 |