Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6818996 | Multi-level redistribution layer traces for reducing current crowding in flipchip solder bumps | Senol Pekin | 2004-11-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6818996 | Multi-level redistribution layer traces for reducing current crowding in flipchip solder bumps | Senol Pekin | 2004-11-16 |