Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6828250 | Process for etching vias in organosilicate glass materials without causing RIE lag | William Frederick Bosch | 2004-12-07 |
| 6777344 | Post-etch photoresist strip with O2 and NH3 for organosilicate glass low-K dielectric etch applications | Ian J. Morey, Chok W. Ho | 2004-08-17 |
| 6700200 | Reliable via structures having hydrophobic inner wall surfaces | — | 2004-03-02 |