Issued Patents 2004
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6777313 | Semiconductor device manufacturing method for reinforcing chip by use of seal member at pickup time | Shinya Takyu, Mika Kiritani, Terunari Takano | 2004-08-17 |
| 6774011 | Chip pickup device and method of manufacturing semiconductor device | Takahito Nakazawa, Hideo Numata, Shinya Takyu | 2004-08-10 |
| 6756562 | Semiconductor wafer dividing apparatus and semiconductor device manufacturing method | Shinya Takyu, Ninao Sato | 2004-06-29 |
| 6739326 | Semiconductor manufacturing equipment | Hideo Numata, Keisuke Tokubuchi | 2004-05-25 |
| 6709543 | Semiconductor chip pickup device and pickup method | — | 2004-03-23 |
| 6699774 | Wafer splitting method using cleavage | Shinya Takyu | 2004-03-02 |