Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6777313 | Semiconductor device manufacturing method for reinforcing chip by use of seal member at pickup time | Mika Kiritani, Tetsuya Kurosawa, Terunari Takano | 2004-08-17 |
| 6774011 | Chip pickup device and method of manufacturing semiconductor device | Takahito Nakazawa, Tetsuya Kurosawa, Hideo Numata | 2004-08-10 |
| 6756562 | Semiconductor wafer dividing apparatus and semiconductor device manufacturing method | Tetsuya Kurosawa, Ninao Sato | 2004-06-29 |
| 6699774 | Wafer splitting method using cleavage | Tetsuya Kurosawa | 2004-03-02 |