Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6836012 | Semiconductor package and method of manufacturing the same | Hiroshi Funakura, Eiichi Hosomi, Yasuhiro Koshio, Tetsuya Nagaoka, Mitsuru Oida +4 more | 2004-12-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6836012 | Semiconductor package and method of manufacturing the same | Hiroshi Funakura, Eiichi Hosomi, Yasuhiro Koshio, Tetsuya Nagaoka, Mitsuru Oida +4 more | 2004-12-28 |