Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6836012 | Semiconductor package and method of manufacturing the same | Hiroshi Funakura, Yasuhiro Koshio, Tetsuya Nagaoka, Junya Nagano, Mitsuru Oida +4 more | 2004-12-28 |
| 6768206 | Organic substrate for flip chip bonding | — | 2004-07-27 |
| 6740981 | Semiconductor device including memory unit and semiconductor module including memory units | — | 2004-05-25 |